UPS540

Features: `Low Profile Maximum height of 1.1 mm`Footprint Area of 10 mm`Low VF Provides Higher Efficiency`Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink`Supplied in 8mm Tape and Reel 3,000 units/7 Reel; 12,000 units/13 ReelApplication·High power Surface Mou...

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UPS540 Picture
SeekIC No. : 004538422 Detail

UPS540: Features: `Low Profile Maximum height of 1.1 mm`Footprint Area of 10 mm`Low VF Provides Higher Efficiency`Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink`Supplie...

floor Price/Ceiling Price

Part Number:
UPS540
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/4

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Product Details

Description



Features:

`Low Profile Maximum
    height of 1.1 mm
`Footprint Area of 10 mm
`Low VF Provides Higher
   Efficiency
`Low Thermal Resistance with
   Direct Thermal Path of Die on
   Exposed Cathode Heat Sink
`Supplied in 8mm Tape and
   Reel 3,000 units/7" Reel;
   12,000 units/13" Reel



Application

·High power Surface Mount
   Package
·Guard Ring Protection
·Low forward voltage
·Integral Heat Sink/Locking
   Tabs
·Compatible with Automatic
   Insertion Equipment
·Full Metallic Bottom
   Eliminates Flux Entrapment



Pinout

RATING
(Conditions)
SYMBOL
VALUE
UNIT
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
V
V
Average Rectified Forward Current (@ Rated VR and TC = 100°C)
IO
0.5
A
Repetitive Peak Surge Current (Non-Repetitive peak surge current
@ IO = 0.5 Amps )
IFSM
10
A
Storage Temperature Range
Tstg, TC
-55 to 125
°C
Operating Temperature Range
TJ
-55 to 125
°C
Voltage Rate of Change (@ Rated VR and TJ = 25°C)
dv/dt
1000
V/ms



Description

In Microsemi's new Powermite SMT Package, these high efficiency Schottky rectifiers UPS540 offer power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite package features of UPS540  include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.




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