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UPS5100

Features: ` High power surface mount package.` Guard Ring die construction for transient protection.` Silicon Schottky rectifiers no reverse voltage recovery.` Internal heat sink locking tabs` Low forward voltage.` Full metallic bottom eliminates flux entrapment` Compatible with automatic insertio...

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SeekIC No. : 004538419 Detail

UPS5100: Features: ` High power surface mount package.` Guard Ring die construction for transient protection.` Silicon Schottky rectifiers no reverse voltage recovery.` Internal heat sink locking tabs` Low f...

UPS5100 Data Sheet

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Part Number:
UPS5100
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

` High power surface mount package.
` Guard Ring die construction for transient protection.
` Silicon Schottky rectifiers no reverse voltage recovery.
` Internal heat sink locking tabs
` Low forward voltage.
` Full metallic bottom eliminates flux entrapment
` Compatible with automatic insertion equipment
` Low profile-maximum height of 1mm supplied in 16 mm tape reel- 5000 units/ 13" reel.


Application

· Switching and Regulating Power Supplies.
· Charge Pump Circuits.
· Reduces reverse recovery loss due to low IRM.
· Small foot print 190 X 300 mils 1:1 Actual size


Specifications

Rating Symbol Value Unit
Peak Repetitive ReverseVoltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 40 V
RMS Reverse Voltage V R (RMS) 28 V
Average Rectified Output Current Io 5 A
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine wave Superimposedon Rated Load@ Tc =90 ºC IFSM 100 A
Storage Temperature
Operating Temperature		 T stg
T op		 -55 to +150
-55 to +125		 ºC
ºC



Description

In Microsemi's new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.




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