Features: ` High power surface mount package.` Guard Ring die construction for transient protection.` Silicon Schottky rectifiers no reverse voltage recovery.` Internal heat sink locking tabs` Low forward voltage.` Full metallic bottom eliminates flux entrapment` Compatible with automatic insertio...
UPS5100: Features: ` High power surface mount package.` Guard Ring die construction for transient protection.` Silicon Schottky rectifiers no reverse voltage recovery.` Internal heat sink locking tabs` Low f...
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Rating | Symbol | Value | Unit |
Peak Repetitive ReverseVoltage Working Peak Reverse Voltage DC Blocking Voltage |
VRRM VRWM VR |
40 | V |
RMS Reverse Voltage | V R (RMS) | 28 | V |
Average Rectified Output Current | Io | 5 | A |
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine wave Superimposedon Rated Load@ Tc =90 ºC | IFSM | 100 | A |
Storage Temperature Operating Temperature |
T stg T op |
-55 to +150 -55 to +125 |
ºC ºC |
In Microsemi's new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.
In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.