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UPS520

Features: `Low Profile Maximum height of 1.1 mm`Footprint Area of 10 mm2`Low VF Provides Higher Efficiency`Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink`Supplied in 8mm Tape and Reel 3,000 units/7 Reel; 12,000 units/13 ReelApplication• Case: Molded Ep...

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SeekIC No. : 004538420 Detail

UPS520: Features: `Low Profile Maximum height of 1.1 mm`Footprint Area of 10 mm2`Low VF Provides Higher Efficiency`Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink`Suppli...

UPS520 Data Sheet

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Part Number:
UPS520
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

`Low Profile Maximum height of 1.1 mm
`Footprint Area of 10 mm2
`Low VF Provides Higher Efficiency
`Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
`Supplied in 8mm Tape and Reel 3,000 units/7"Reel; 12,000 units/13" Reel


Application

• Case: Molded Epoxy
• Meets UL94VO at 1/8 inch
• Device Marking S52
• Lead and Mounting Surface Temperature for Soldering = 260°C Maximum for 10 Seconds


Specifications

RATING
(Conditions)
SYMBOL
VALUE
UNIT
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
V
V
V
Average Rectified Forward Current (@ Rated VR and TC = 100)
IO
0.5
A
Repetitive Peak Surge Current (Non-Repetitive peak surge current @ IO = 0.5 Amps )
IFSM
10
A
Storage Temperature Range
TSTG, TC
-55 to 125
Operating Temperature Range
TJ
-55 to 125
Voltage Rate of Change (@ Rated VR and TJ = 25)
dv/dt
1000
V/us



Description

In Microsemi's new Powermite SMT Package, these high efficiency Schottky rectifiers offer power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment




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