UM9701

Features: ·Specified low distortion ·Low Forward Resistance ·High Reverse Resistance ·High Voltage Capability ·Good Power Handling ·Microsemi Ruggedness and reliability ·Compatible with automatic insertionequipmentApplication·Little or no Bias required. ·Available in leaded or surface mount packag...

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UM9701 Picture
SeekIC No. : 004537210 Detail

UM9701: Features: ·Specified low distortion ·Low Forward Resistance ·High Reverse Resistance ·High Voltage Capability ·Good Power Handling ·Microsemi Ruggedness and reliability ·Compatible with automatic in...

floor Price/Ceiling Price

Part Number:
UM9701
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2025/1/6

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Product Details

Description



Features:

·Specified low distortion
·Low Forward Resistance
·High Reverse Resistance
·High Voltage Capability
·Good Power Handling
·Microsemi Ruggedness and reliability  
·Compatible with automatic insertion equipment



Application

·Little or no Bias required.
·Available in leaded or surface mount packages.
·RoHS compliant packaging available: use UMX9701B, etc



Specifications

Rating
Symbol
Value
Unit
Reverse Voltage
VR
100
Volts
AVERAGE Power Dissipation
Free Air at 25
PA
500
mW
Average Power Dissipation
1/2"(12.7 mm) Total lead Length
to 25 Contacts
PA
2.5
Derate linearly
To 175
Watts
Storage Temperature
Tstg
-65 to 175
Operating Temperature
Top
-65 to 175



Description

The UM9701 PIN diode was designed for low resistance at low forward bias current and low reverse bias apacitance. This unique Microsemi design results in both forward and reverse bias.

These PIN diodes UM9701 are characterized for low current drain RF and microwave switch applications particularly for digital filter switch designs. The construction and geometry of these devices provide good voltage and power handling
capability.

These devices UM9701 are constructed using a metallurgical full face bond to both surfaces of the silicon chip. A glass enclosure houses this bond in a reliable and hermetic package. The axial leads are attached to refractory pins and do not touch the glass enclosure.

Environmentally these, and all Microsemi PIN diodes UM9701, can withstand thermal cycling from -195 to + 300 and exceed almilitary environmental specifications for shock, vibration, acceleration, and moisture resistance.




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