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U3D

Features: • Oxide planar chip junction• Ultrafast recovery time• Low forward voltage, low power losses• High forward surge capability• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C• Solder dip 260 °C, 40 s• Component in accordance to RoHS 200...

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SeekIC No. : 004534833 Detail

U3D: Features: • Oxide planar chip junction• Ultrafast recovery time• Low forward voltage, low power losses• High forward surge capability• Meets MSL level 1, per J-STD-020,...

U3D Data Sheet

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Part Number:
U3D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Oxide planar chip junction
• Ultrafast recovery time
• Low forward voltage, low power losses
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC




Application

For us in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and telecommunication.






Specifications

PARAMETER SYMBOL U3B U3C U3D UNIT
Device marking code U3B U3C U3D
Maximum repetitive peak reverse voltage VRRM 100 150 200 V
Maximum average forward rectified current
(Fig. 1)		 TM = 134 °C
TM = 125 °C		 IF(AV) 2.0 (1)
3.0 (2)		 A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load		 IFSM 100 A
Operating junction and storage temperature range TJ, TSTG - 55 to + 150
Notes:
(1) Free air, mounted on recommende copper pad area
(2) Units mounted on P.C.B. with 0.47 x 0.47" (12 x 12 mm) copper pad areas.




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