Features: · Advanced trench process technology· High Density Cell Design for Ultra Low On-Resistance· Fully Characterized Avalanche Voltage and CurrentSpecifications Parameter Symbol Max n-channel Units Drain-Source Voltage VDS 25 V Gate-Source Voltage VGS...
TSM4410: Features: · Advanced trench process technology· High Density Cell Design for Ultra Low On-Resistance· Fully Characterized Avalanche Voltage and CurrentSpecifications Par...
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Parameter | Symbol | Max n-channel | Units | |
Drain-Source Voltage | VDS | 25 | V | |
Gate-Source Voltage | VGS | ±20 | V | |
Continuous Drain Current | ID | 10 |
A | |
Pulsed Drain Current | IDM | 50 | ||
Maximum Power Dissipation | TA=25 | PD | 2 | W |
TA=100 | 1.3 | |||
Operating Junction Temperature | TJ | +150 | ||
Junction and Storage Temperature Range | TJ, TSTG | -55 to 150 |