Features: · Advanced trench process technology· High density cell design for ultra low on-resistance· Fully Characterized Avalanche Voltage and Current· Improved Shoot-Through FOMSpecifications Parameter Symbol Maximum Units Drain-Source Voltage VDS -20...
TSM3443: Features: · Advanced trench process technology· High density cell design for ultra low on-resistance· Fully Characterized Avalanche Voltage and Current· Improved Shoo...
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Parameter | Symbol | Maximum | Units | |
Drain-Source Voltage | VDS | -20V | V | |
Gate-Source Voltage | VGS | ±12 | V | |
Continuous Drain Current | ID | -4.7 | A | |
Pulsed Drain Current | IDM | -20 | A | |
Power Dissipation B | Ta =25°C | PD | 2 | W |
Ta = 70 °C | 1.3 | W/°C | ||
Junction and Storage Temperature Range | TJ, TSTG | -55 to 150 | °C | |
Operating Junction and Storage Temperature Range | TJ | +150 | °C |