TSM3400

Features: Rugged and reliableHigh density cell design for ultra low on-resistanceExcellent thermal and electrical capabilitiesCompact and low profile SOT-23 packageSpecifications Parameter Symbol Limit Unit Drain-Source Voltage VDS 30V V Gate-Source Voltage VGS ±...

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SeekIC No. : 004529653 Detail

TSM3400: Features: Rugged and reliableHigh density cell design for ultra low on-resistanceExcellent thermal and electrical capabilitiesCompact and low profile SOT-23 packageSpecifications Parameter S...

floor Price/Ceiling Price

Part Number:
TSM3400
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

Rugged and reliable
High density cell design for ultra low on-resistance
Excellent thermal and electrical capabilities
Compact and low profile SOT-23 package



Specifications

Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30V
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current
ID
3.5
A
Pulsed Drain Current
IDM
13
A
Maximum Power Dissipation Ta = 25
PD
1.25
W
Ta = 75
0.8
Operating Junction Temperature
TJ
+150
Operating Junction and Storage Temperature Range
TJ, TSTG
- 55 to +150



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