Features: · Advanced trench process technology· High density cell design for ultra low on-resistance· N-Channel 2.5V (G-S) MOSFET· Excellent thermal and electrical capabilitiesSpecifications Symbol Parameter Limit Units VDS Drain-Source Voltage ...
TSM3442: Features: · Advanced trench process technology· High density cell design for ultra low on-resistance· N-Channel 2.5V (G-S) MOSFET· Excellent thermal and elect...
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Symbol | Parameter | Limit | Units | |
VDS | Drain-Source Voltage | 20V | V | |
VGS | Gate-Source Voltage | ±8 | V | |
ID | Continuous Drain Current | 3.6 | A | |
IDM | Pulsed Drain Current | 10 | A | |
TJ | Operating Junction Temperature | +150 | °C | |
PD | Maximum Power Dissipation | Ta = 25 °C | 1.5 |
W |
Ta = 75°C | 1.0 | |||
TJ, TSTG | Operating Junction and Storage Temperature Range |
-55 to 150 | °C |