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TSBD-3500D-1B

Features: Large die for high power capabilityVery low forward voltage dropBuilt-in stress relief mechanismfor die protectionSilver plated substrates for corrosion resistance and superior soldeabilitySoldering temperature: 250 C maximum oProtects expensive automotive electronics and mobile equipmen...

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TSBD-3500D-1B: Features: Large die for high power capabilityVery low forward voltage dropBuilt-in stress relief mechanismfor die protectionSilver plated substrates for corrosion resistance and superior soldeabilit...

TSBD-3500D-1B Data Sheet

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Part Number:
TSBD-3500D-1B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

Large die for high power capability
Very low forward voltage drop
Built-in stress relief mechanismfor die protection
Silver plated substrates for corrosion resistance and superior soldeability
Soldering temperature: 250 C maximum o
Protects expensive automotive electronics and mobile equipment


Specifications

PARAMETER (TEST CONDITIONS SYMBOL RATINGS UNITS
MaximumRecurrent Peak Reverse Voltage VRRM 23 VOLTS
Working Peak Reverse Voltage VRRM
MaximumDC Blocking Voltage VDC
Breakdown Voltage (IR = 100 mA dc, Tc = 25 C) V(BR) 24 Min / 32 Max
Average Forward Rectified Current IO 35 AMPS
Non-repetitive Peak Forward Surge Current
(Half wave, single phase, 60 Hz sine applied to rated load)		 IFSM 600
Repetitive Peak Reverse Surge Current (Time Constant = 10 mSec
Duty Cycle < 1.0%, Tc = 25 C		 IRSM 110
Instantaneous Forward Voltage
(IF = 100A@300mSec pulse,TC = 25oC)		 VF 1.05
1.00
 VOLTS
MaximumDC Reverse Current (VR = 20V DC, Tc = 25 C) IR 200 nA
MaximumThermal Resistance, Junction to Case (Note 1) RqJC
 0.8 °C/W
Junction Operating & Storage Temperature Range TJ,TSTG -65 to +175 °C



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