Features: Large die for high power capabilityVery low forward voltage dropIncreased capacity by parallel operationProtects expensive automotive electronics andmobile equipmentSpecifications PARAMETER (TEST CONDITIONS SYMBOL RATINGS UNITS MaximumRecurrent Peak Reverse Voltage VRRM 23 ...
TSBD-3500-1B: Features: Large die for high power capabilityVery low forward voltage dropIncreased capacity by parallel operationProtects expensive automotive electronics andmobile equipmentSpecifications PAR...
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Features: Large die for high power capabilityVery low forward voltage dropBuilt-in stress relief m...
Features: Large die for high power capabilityVery low forward voltage dropIncreased capacity by pa...
Features: Very low forward voltage dropIncreased capacity by parallel operationProtects expensive ...
PARAMETER (TEST CONDITIONS | SYMBOL | RATINGS | UNITS |
MaximumRecurrent Peak Reverse Voltage | VRRM | 23 | VOLTS |
Working Peak Reverse Voltage | VRRM | ||
MaximumDC Blocking Voltage | VDC | ||
Breakdown Voltage (IR = 100 mA dc, Tc = 25 C) | V(BR) | 24 Min / 32 Max | |
Average Forward Rectified Current | IO | 35 | AMPS |
Non-repetitive Peak Forward Surge Current (Half wave, single phase, 60 Hz sine applied to rated load) |
IFSM | 600 | |
Repetitive Peak Reverse Surge Current (Time Constant = 10 mSec Duty Cycle < 1.0%, Tc = 25 C |
IRSM | 110 | |
Instantaneous Forward Voltage (IF = 100A@300mSec pulse,TC = 25oC) |
VF | 1.05 1.00 |
VOLTS |
MaximumDC Reverse Current (VR = 20V DC, Tc = 25 C) | IR | 200 | nA |
MaximumThermal Resistance, Junction to Case (Note 1) | RqJC |
0.8 | °C/W |
Junction Operating & Storage Temperature Range | TJ,TSTG | -65 to +175 | °C |