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TS3USB30

Features: · VCC Operation at 3.0 V and 4.3 V· 1.8-V Compatible Control-Pin Inputs· IOFF Supports Partial Power Down Mode Operation· ron = 10 W Max· Dron <0.35 W Typ· Cio(on) = 7 pF Typ· Low Power Consumption (1 mA Max)· 6KV ESD protection· -3dB Bandwidth = 955-MHz Typ· Packaged in 10-pin TQFN (...

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SeekIC No. : 004528695 Detail

TS3USB30: Features: · VCC Operation at 3.0 V and 4.3 V· 1.8-V Compatible Control-Pin Inputs· IOFF Supports Partial Power Down Mode Operation· ron = 10 W Max· Dron <0.35 W Typ· Cio(on) = 7 pF Typ· Low Power...

TS3USB30 Data Sheet

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Part Number:
TS3USB30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

· VCC Operation at 3.0 V and 4.3 V
· 1.8-V Compatible Control-Pin Inputs
· IOFF Supports Partial Power Down Mode Operation
· ron = 10 W Max
· Dron <0.35 W Typ
· Cio(on) = 7 pF Typ
· Low Power Consumption (1 mA Max)
· 6KV ESD protection
· -3dB Bandwidth = 955-MHz Typ
· Packaged in 10-pin TQFN (1.4mm x 1.8mm)


Application

· Routes Signals for USB 1.0, 1.1, and 2.0


Pinout

Connection Diagram


Specifications

over operating free-air temperature range (unless otherwise noted)
  MIN MAX UNIT
VCC    Supply voltage range -0.5 4.6 V
VIN     Control input voltage range(2) (3) -0.5 VCC V
VI/O   Switch I/O voltage range(2) (3) (4) -0.5 VCC V
IIK      Control input clamp current VIN < 0   -50 mA
II/OK   I/O port clamp current VI/O < 0   -50 mA
II/O     ON-state switch current(5)   ±64 mA
           Continuous current through VCC or GND   ±100 mA
JA       Package thermal impedance(6)     /W
Tstg      Storage temperature range -65 150

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.


Description

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30 is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).




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