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TS3USB221

Features: ` VCC Operation at 2.5 V and 3.3 V` VIO Accepts Signals up to 5.5 V` 1.8-V Compatible Control-Pin Inputs` Low-Power Mode When OE Is Disabled (1 A)` ron = 6 W Max` ron = 0.2 Typ` Cio(on) = 6 pF Max` Low Power Consumption (30 A Max)` ESD > 2000-V Human-Body Model (HBM)` High Bandwidth (...

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SeekIC No. : 004528694 Detail

TS3USB221: Features: ` VCC Operation at 2.5 V and 3.3 V` VIO Accepts Signals up to 5.5 V` 1.8-V Compatible Control-Pin Inputs` Low-Power Mode When OE Is Disabled (1 A)` ron = 6 W Max` ron = 0.2 Typ` Cio(on) = ...

TS3USB221 Data Sheet

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Part Number:
TS3USB221
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

` VCC Operation at 2.5 V and 3.3 V
` VIO Accepts Signals up to 5.5 V
` 1.8-V Compatible Control-Pin Inputs
` Low-Power Mode When OE Is Disabled (1 A)
` ron = 6 W Max
` ron = 0.2  Typ
` Cio(on) = 6 pF Max
` Low Power Consumption (30 A Max)
` ESD > 2000-V Human-Body Model (HBM)
` High Bandwidth (1.1 GHz Typ)


Application

Routes Signals for USB 1.0, 1.1, and 2.0


Pinout

Connection Diagram


Specifications

Symbol
 Parameter
MIN
MAX
Unit
VCC
 Supply voltage range
-0.5
4.6
V
VIN
 Control input voltage range(2) (3)
-0.5
7
V
VI/O
 Switch I/O voltage range(2) (3) (4)
-0.5
7
V
IIK
 Control input clamp current VIN < 0
50
mA
II/OK
 I/O port clamp current VI/O < 0
50
mA
II/O
 ON-state switch current(5)
±64
mA
  Continuous current through VCC or GND
±100
mA
JA
 Package thermal impedance(6) DRC package
RSE package
ZXU package
48.7
TBD
TBD
/W
Tstg
 Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
-65
150


(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.




Description

The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB221 is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).




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