TPA751D

Available Set Gain :
Common Mode Rejection Ratio (Min) :
Mounting Style : SMD/SMT
Packaging : Tube
Maximum Operating Temperature : + 85 C
Package / Case : SOIC-8
Output Type : 1-Channel Mono
Operating Supply Voltage : 3 V, 5 V
Product : Class-AB
Output Power : 700 mW
THD plus Noise : 0.55 %
Maximum Power Dissipation : 725 mW
Supply Current : 1.45 mA


Features:

` Fully Specified for 3.3-V and 5-V Operation
` Wide Power Supply Compatibility 2.5 V 5.5 V
` Power Supply Rejection at 217 Hz
84 dB at V<sub>DD</sub> = 5 V
81 dB at V<sub>DD</sub> = 3.3 V
` Output Power for RL = 8
700 mW at V_DD = 5 V
250 mW at V_DD = 3.3 V
` Ultralow Supply Current in Shutdown
Mode . . . 1.5 nA
` Thermal and Short-Circuit Protection
` Surface-Mount Packaging
SOIC
PowerPAD MSOP
MicroStar Junior (BGA)


Pinout




Specifications

Supply voltage, V_DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 6 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to V_DD +0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . Internally limited (see Dissipation Rating Table)
Operating free-air temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 to 85
Operating junction temperature range, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 to 150
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 to 150
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .       260
¶ Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Description

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.

The TPA751 is available in a 3.0 * 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD MSOP.

Parameters:

Technical/Catalog Information	TPA751D
Vendor	Texas Instruments
Category	Integrated Circuits (ICs)
Package / Case	8-SOIC (3.9mm Width)
Type	Class AB
Output Type	1-Channel (Mono)
Voltage - Supply	2.5 V ~ 5.5 V
Packaging	Tube
Features	Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Max Output Power x Channels @ Load	700mW x 1 @ 8 Ohm
Drawing Number	296; 4040047-2; D; 8
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	TPA751D TPA751D 296 10855 5 ND 296108555ND 296-10855-5