TPA701

Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility .5 V 5.5 V`Output Power for RL = 8 700 mW at VDD = 5 V, BTL 250 mW at VDD = 3.3 V, BTL`Ultra-Low Quiescent Current in Shutdown ode . . . 1.5 A`Thermal and Short-Circuit Protection`Surface-Mount Packaging SOIC ...

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TPA701 Picture
SeekIC No. : 004526102 Detail

TPA701: Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility .5 V 5.5 V`Output Power for RL = 8 700 mW at VDD = 5 V, BTL 250 mW at VDD = 3.3 V, BTL`Ultra-Low Quiescent Cu...

floor Price/Ceiling Price

Part Number:
TPA701
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

`Fully Specified for 3.3-V and 5-V Operation
`Wide Power Supply Compatibility .5 V 5.5 V
`Output Power for RL = 8
700 mW at VDD = 5 V, BTL
250 mW at VDD = 3.3 V, BTL
`Ultra-Low Quiescent Current in Shutdown ode . . . 1.5 A
`Thermal and Short-Circuit Protection
`Surface-Mount Packaging
SOIC
PowerPADE™MSOP



Pinout

  Connection Diagram


Specifications

Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . 0.3 V to VDD +0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (See Dissipation Rating Table)
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.



Description

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications here internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of ontinuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although his device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as ireless communications. The BTL configuration eliminates the need for external coupling capacitors on the utput in most applications, which is particularly important for small battery-powered equipment. This device eatures a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. he TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP,  hich reduces board space by 50% and height by 40%.




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