TPA751

Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility 2.5 V 5.5 V`Power Supply Rejection at 217 Hz 84 dB at VDD = 5 V 81 dB at VDD = 3.3 V`Output Power for RL = 8 Ω 700 mW at VDD = 5 V 250 mW at VDD = 3.3 V`Ultralow Supply Current in Shutdown Mode . . . ...

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TPA751 Picture
SeekIC No. : 004526107 Detail

TPA751: Features: `Fully Specified for 3.3-V and 5-V Operation`Wide Power Supply Compatibility 2.5 V 5.5 V`Power Supply Rejection at 217 Hz 84 dB at VDD = 5 V 81 dB at VDD = 3.3 V`Output Power for RL = 8...

floor Price/Ceiling Price

Part Number:
TPA751
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

`Fully Specified for 3.3-V and 5-V Operation
`Wide Power Supply Compatibility 2.5 V 5.5 V
`Power Supply Rejection at 217 Hz
    84 dB at VDD = 5 V
    81 dB at VDD = 3.3 V
`Output Power for RL = 8 Ω
    700 mW at VDD = 5 V
    250 mW at VDD = 3.3 V
`Ultralow Supply Current in Shutdown  Mode . . . 1.5 nA
`Thermal and Short-Circuit Protection
`Surface-Mount Pack
    SOIC
    PowerPAD™ MSOP
    MicroStar Junior™(BGA)



Pinout

  Connection Diagram


Specifications

Supply voltage, VDD  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 V
Input voltage, VI  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V to VDD +0.3 V
Continuous total power dissipation  . . . . . . . . . . . . . . . . . . . . .Internally limited (see Dissipation Rating Table)
Operating free-air temperature range, TA  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . .40°C to 85°C
Operating junction temperature range, TJ  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . .40°C to 150°C
Storage temperature range, Tstg  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C



Description

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required.  Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™(BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™MSOP.




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