TMS470R1A384

Features: ` High-Performance Static CMOS Technology ` TMS470R1x 16/32-Bit RISC Core (ARM7TDMI™) 24-MHz System Clock (48-MHz Pipeline) (SCIs) Independent 16/32-Bit Instruction Set Open Architecture With Third-Party Support Built-In Debug Module ` Integrated Memory 384K-Byte Program Flash...

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SeekIC No. : 004525144 Detail

TMS470R1A384: Features: ` High-Performance Static CMOS Technology ` TMS470R1x 16/32-Bit RISC Core (ARM7TDMI™) 24-MHz System Clock (48-MHz Pipeline) (SCIs) Independent 16/32-Bit Instruction Set Open Archi...

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Part Number:
TMS470R1A384
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

` High-Performance Static CMOS Technology
` TMS470R1x 16/32-Bit RISC Core  (ARM7TDMI™) 
    24-MHz System Clock (48-MHz Pipeline) (SCIs)
    Independent 16/32-Bit Instruction Set 
    Open Architecture With Third-Party Support 
    Built-In Debug Module
` Integrated Memory 
    384K-Byte Program Flash 
       ` Three Banks With 18 Contiguous Sectors
     32K-Byte Static RAM (SRAM)
` Operating Features
    Core Supply Voltage (VCC): 1.71 V2.05 V
    I/O Supply Voltage (VCCIO): 3.0 V3.6 V
    Low-Power Modes: STANDBY and HALT
     Extended Industrial Temperature Range
` 470+ System Module
     32-Bit Address Space Decoding
    Bus Supervision for Memory/Peripherals
     Analog Watchdog (AWD) Timer
    Enhanced Real-Time Interrupt (RTI)
    Interrupt Expansion Module (IEM)
    System Integrity and Failure Detection
` Direct Memory Access (DMA) Controller
   32 Control Packets and 16 Channels
` Zero-Pin Phase-Locked Loop (ZPLL)-Based Clock Module With Prescaler
    Multiply-by-4 or -8 Internal ZPLL Option
    ZPLL Bypass Mode
` Expansion Bus Module (EBM) (PGE Package only)
     Supports 8- and 16-Bit Expansion Bus Memory Interface Mappings
      40 I/O Expansion Bus Pins
` Ten Communication Interfaces:
    Two Serial Peripheral Interfaces (SPIs)
` 255 Programmable Baud Rates
    Two Serial Communication Interfaces (SCIs)
` 224 Selectable Baud Rates
` Asynchronous/Isosynchronous Modes
    Two Standard CAN Controllers (SCC)
` 16-Mailbox Capacity
    Fully Compliant With CAN Protocol, Version 2.0B
    Class II Serial Interface B (C2SIb)
` Normal 10.4 Kbps and 4X Mode 41.6 Kbps
    Three Inter-Integrated Circuit (I2C) Modules
` Multi-Master and Slave Interfaces
` Up to 400 Kbps (Fast Mode)
` 7- and 10-Bit Address Capability
` High-End Timer (HET)
    12 Programmable I/O Channels:
       ` 12 High-Resolution Pins Bus Supervision for Memory/Peripherals
    High-Resolution Share Feature (XOR)
    High-End Timer RAM
       ` 64-Instruction Capacity
` External Clock Prescale (ECP) Module
    Programmable Low-Frequency External Clock (CLK) 
` 12-Channel 10-Bit Multi-Buffered ADC
    32-Word FIFO Buffer
    Single- or Continuous-Conversion Modes
    1.55 µs Minimum Sample/Conversion Time
    Calibration Mode and Self-Test Features only)
` 55 Dedicated General-Purpose I/O (GIO) Pins  and 39 Additional Peripheral I/Os (PGE)
` 14 Dedicated General-Purpose I/O (GIO) Pins and 39 Additional Peripheral I/Os (PZ)
` Flexible Interrupt Handling
` 8 External Interrupts
` On-Chip Scan-Base Emulation Logic, IEEE Standard 1149.1(1) (JTAG) Test-Access Port
` 144-Pin Plastic Low-Profile Quad Flatpack (PGE Suffix)





Pinout

  Connection Diagram


Specifications

over operating free-air temperature range(1)
Supply voltage range:      VCC(2)                                                           -0.5 V to 2.5 V
Supply voltage range:      VCCIO , VCCAD , VCCP (flash pump)(2)            -0.5 V to 4.1V
Input voltage range:        All 5 V- tolerant input pins                             -0.5 V to 6.0V
                                         All other input pins                                        -0.5 V to 4.1V
Input clamp current:         All 5-V tolerant pins, PORRST,TRST , TEST,
                                         and TCK (VI < 0)                                                  -20 mA(3)
                                         ADIN[0:11] IIK (VI < 0 or VI > VCCAD)                    ±10 mA
                                         All other pins IIK (VI < 0 or VI > VCCAD)                 ±20 mA
Operating free-air temperature range,TA T version                              -40 to 105
                                                                Q version                              -40 to 125
Operating junction temperature range,TJ                                             -40 to 150
Storage temperature range, Tstg                                                          -40 to 150

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the 
     device.  These are stress ratings only, and functional operation of the device at these or any other
     conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure
     to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to their associated grounds.
(3) These pins do not have an internal clamp diode to a positive supply voltage.





Description

The TMS470R1A384(1) devices are members of the Texas Instruments TMS470R1x family of general-purpose 16/32-bit reduced instruction set computer (RISC) microcontrollers. The A384 microcontroller offers high performance utilizing the high-speed ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The A384 utilizes the big-endian format where the most significant byte of a word is stored at the lowest-numbered byte and the least significant byte at the highest numbered byte.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The A384 RISC core architecture offers solutions to these performance and cost demands while maintaining low power consumption.






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