Features: ` CMOS/EEPROM/EPROM Technologies on a Single Device
Mask-ROM Devices for High-Volume Production
One-Time-Programmable (OTP) EPROM Devices for Low-Volume Production
Reprogrammable-EPROM Devices for Prototyping Purposes
` Internal System Memory Configurations
On-Chip Program Memory Versions
ROM: 16K Bytes
EPROM: 16K Bytes
Data EEPROM: 256 Bytes
Static RAM: 256 Bytes Usable as Registers
Standby RAM With Separate Power Supply Pin: 256 Bytes
` Flexible Operating Features
Low-Power Modes: STANDBY and HALT
Commercial, Industrial, and Automotive Temperature Ranges
Clock Options
Divide-by-1 (2 MHz5 MHz SYSCLK) Phase-Locked Loop (PLL)
Divide-by-4 (0.5 MHz5 MHz SYSCLK)
Supply Voltage (VCC) 5 V ±10%
` Programmable Acquisition and Control Timer (PACT) Module
Input Capture on up to Six Pins, Four of Which Can Have a Programmable Prescaler
One Input Capture Pin Can Drive an 8-Bit Event Counter
Up to Eight Timer-Driven Outputs
Interaction Between Event Counter and Timer Activity
18 Independent Interrupt Vectors
Watchdog With Selectable Time-Out Period
Asynchronous Mini Serial Communication Interface (Mini SCI)
` Flexible Interrupt Handling
Two Software-Programmable Interrupt Levels
Global- and Individual-Interrupt Masking
Programmable Rising- or Falling-Edge Detect
Individual-Interrupt Vectors
` Serial Peripheral Interface (SPI)
Variable-Length High-Speed Shift Register
Synchronous Master/Slave Operation
` Eight Channel 8-Bit Analog-to-Digital Converter 1 (ADC1)
` TMS370 Series Compatibility
Register-to-Register Architecture
256 General-Purpose Registers
14 Powerful Addressing Modes
Instructions Upwardly Compatible With All TMS370 Devices
` CMOS/TTL Compatible I/O Pins/Packages
All Peripheral Function Pins Software Configurable for Digital I/O
16 Bidirectional Pins, Nine Input Pins
44-Pin Plastic and Ceramic Leaded Chip Carrier (LCC) Packages
` Workstation/PC-Based Development System
C Compiler and C Source Debugger
Real-Time In-Circuit Emulation
Multi-Window User Interface
Microcontroller ProgrammerPinout
SpecificationsSupply voltage range,VCC1 (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..0.6 V to 7 V
Input voltage range, All pins except MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.6 V to7 V
MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 V to 14 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current per buffer, IO (VO = 0 to VCC)) (see Note 5) . . . . . . . . . . . . . . . . . . . . ±10 mA
Maximum ICC current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 mA
Maximum ISS current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 mA
Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 W
Operating free-air temperature, TA: L version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C
T version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 105°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65°C to 150°C
NOTES: 4. Unless otherwise noted, all voltage values are with respect to VSS1.
5. Electrical characteristics are specified with all output buffers loaded with specified IO current. Exceeding the specified IO current in any buffer can affect the levels on other buffers.DescriptionThe TMS370C036, TMS370C736, and SE370C736 devices are members of the TMS370 family of single-chip 8-bit microcontrollers. Unless otherwise noted, the term TMS370Cx36 refers to these devices. The TMS370 family provides cost-effective real-time system control through advanced peripheral-function modules and various on-chip memory configurations.
The TMS370Cx36 family of devices uses high-performance silicon-gate CMOS EPROM and EEPROM technologies. Low operating power, wide operating temperature range, and noise immunity of CMOS technology coupled with the high performance and extensive on-chip peripheral functions make the TMS370Cx36 devices attractive for system designs for automotive electronics, industrial motors, computer peripheral controls, telecommunications, and consumer applications.
All TMS370Cx36 devices contain the following on-chip peripheral modules:
Programmable acquisition and control timer (PACT)
Asynchronous mini SCI
PACT watchdog timer
Serial peripheral interface (SPI)
Eight channel, 8-bit analog-to-digital converter 1 (ADC1)
The 16K bytes of mask-programmable ROM in the associated TMS370Cx36 devices are replaced in the TMS370C736 with 16K bytes of EPROM. All other available memory and on-chip peripherals are identical. The OTP (TMS370C736) and reprogrammable (SE370C736) devices are available. The TMS370C736 OTP device is available in a plastic package. This microcontroller is effective to use for immediate production updates for other members of the TMS370Cx36 family or for low-volume production runs when the mask charge or cycle time for the low-cost mask ROM devices is not practical.
The SE370C736 has a windowed ceramic package to allow reprogramming of the program EPROM memory during the development/prototyping phase of design. The SE370C736 device allows quick updates to breadboards and prototype systems while iterating initial designs.The TMS370Cx36 family provides two low-power modes (STANDBY and HALT) for applications where low-power consumption is critical. Both modes stop all CPU activity (that is, no instructions are executed). In the STANDBY mode, the internal oscillator, the PACT counter, and PACT's first command/definition entry remain active. This allows the PACT module to bring the device out of STANDBY mode. In the HALT mode, all device activity is stopped. The device retains all RAM data and peripheral configuration bits throughout both low-power modes.
The TMS370Cx36 features advanced register-to-register architecture that allows direct arithmetic and logical operations without requiring an accumulator (for example, ADD R24, R47; add the contents of register 24 to the contents of register 47 and store the result in register 47). The TMS370Cx36 family is fully instruction-set-compatible, providing easy transition between members of the family.
The TMS370Cx36 has a PACT module that acts as a timer coprocessor by gathering timing information on input signals and controlling output signals with little or no intervention by the CPU. The coprocessor nature of this module allows for levels of flexibility and power not found in traditional microcontroller timers.
The TMS370Cx36 family provides the system designer with an economical, efficient solution to real-time control applications. The PACT compact development tool (CDTE) meets the challenge of efficiently developing the software and hardware required to design the TMS370Cx36 into an ever-increasing number of complex applications. The application source code can be written in assembly and C language, and the output code can be generated by the linker. Precise real-time in-circuit emulation and extensive symbolic debug and analysis tools ensure efficient software and hardware implementation as well as a reduced time-to-market cycle.
The TMS370Cx36 family together with the TMS370 PACT CDT370, BP programmer, software tools, SE370C736 reprogrammable devices, comprehensive product documentation, and customer support provides a complete solution to the needs of the system designer.
TMS370C036A Data Sheet
