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TLP798GA

Features: ·Peak offstate voltage: 400 V (min.) ·Onstate current: 150 mA (max.) (A connection) ·Onstate resistance: 12 (max.) (A connection) ·Isolation voltage: 5000 Vrms (min.) (A connection)·Isolation Thickness: 0.4 mm (min.)Specifications Characteristic Symbol Rating Unit LE...

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TLP798GA: Features: ·Peak offstate voltage: 400 V (min.) ·Onstate current: 150 mA (max.) (A connection) ·Onstate resistance: 12 (max.) (A connection) ·Isolation voltage: 5000 Vrms (min.) (A connection)·Isolat...

TLP798GA Data Sheet

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Part Number:
TLP798GA
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

·Peak offstate voltage: 400 V (min.)  
·Onstate current: 150 mA (max.) (A connection)  
·Onstate resistance: 12  (max.) (A connection)  
·Isolation voltage: 5000 Vrms (min.) (A connection) 
·Isolation Thickness: 0.4 mm (min.) 
 


Specifications

Characteristic
Symbol
Rating
Unit
LED Forward current
Forward current derating (Ta 25°C)
Peak forward current (100 s pulse, 100 pps)
Reverse voltage
Junction temperature
IF
IF / °C
IFP
VR
Tj
30
−0.3
1
5
125
mA
mA / °C
A
V
°C
Detector Off−state output terminal voltage
VOFF
400
V
On−state RMS current A connection
B connection
C connection
ION
150
200
300
mA
On−state current derating (Ta 25°C) A connection
B connection
C connection
ION / °C
−1.5
−2.0
−3.0
mA / °C
Junction temperature
Tj
125
°C
Storage temperature range
Operating temperature range
Lead soldering temperature (10 s)
Tstg
Topr
Tsol
−55~125
−40~85
260
°C
°C
°C
Isolation voltage (AC, 1 min., R.H. 60%) (Note 2)
BVS
5000
Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(Note 2): Device considered a two−terminal device: Pins 1, 2 and 3 shorted together, and pins 4, 5 and 6 shorted together.




Description

The TOSHIBA TLP798GA consists of an aluminum gallium arsenide infrared emitting diode optically coupled to a photoMOS FET in a six lead plastic DIP package (DIP6). The TLP798GA is a bi-directional switch which can replace mechanical relays in many applications.




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