Features: • 4-pin SOP (2.54SOP4): Height = 2.1 mm, Pitch = 2.54 mm• 1-Form-A• Peak Off-state voltage: 350 V (min)• Trigger LED current: 3 mA (max)• On-state current: 120 mA (max)• Limit current: 150 mA~300 mA (t = 5 ms)• On-state resistance: 35 Ω (ma...
TLP174G: Features: • 4-pin SOP (2.54SOP4): Height = 2.1 mm, Pitch = 2.54 mm• 1-Form-A• Peak Off-state voltage: 350 V (min)• Trigger LED current: 3 mA (max)• On-state current: 12...
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Characteristic |
Symbol |
Rating |
Unit | |
LED | Forward current |
IF |
50 |
mA |
Forward current derating (Ta 25) |
IF/ |
-0.5 |
mA/ | |
Peak forward current (100 s pulse, 100 pps) |
IFP |
1 |
A | |
Reverse voltage |
VR |
5 |
V | |
Junction temperature |
Tj |
125 |
||
Detector | Off-state output terminal voltage |
VOFF |
350 |
V |
On-state current |
ION |
120 |
mA | |
On-state current derating (Ta 25) |
ION/ |
-1.2 |
mA/ | |
Junction temperature |
Tj |
125 |
||
Storage temperature range |
Tstg |
-55~125 |
||
Operating temperature range |
Topr |
-40~85 |
||
Lead soldering temperature (10 s) |
Tsol |
260 |
||
Isolation voltage (AC, 1 minute, R.H. < = 60%) (Note 1) |
BVS |
1500 |
Vrms |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: LED side pins shorted together, and detector side pins shorted together.
The Toshiba TLP174G consists of an aluminum gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a SOP, which is suitable for surface mount assembly. The TLP174G is suitable for the modem applications which require space savings.