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TLN117

Features: • Small−side−view epoxy−resin package• High radiant intensity: IE = 0.8mW / sr(min)at IF = 20mA• Half−angle value: 1 / 2 = ±15°(typ.)Specifications Characteristic Symbol Rating Unit Forward current IF 50 mA Pulse fo...

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TLN117: Features: • Small−side−view epoxy−resin package• High radiant intensity: IE = 0.8mW / sr(min)at IF = 20mA• Half−angle value: 1 / 2 = ±15°(typ.)Specification...

TLN117 Data Sheet

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Part Number:
TLN117
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Small−side−view epoxy−resin package
• High radiant intensity: IE = 0.8mW / sr(min)at IF = 20mA
• Half−angle value: 1 / 2 = ±15°(typ.)


Specifications

Characteristic
Symbol
Rating
Unit
Forward current
IF
50
mA
Pulse forward current
IFP
600 (Note 1)
mA
Forward current derating
(Ta > 25)
IF/
−0.33
mA/
Reverse voltage
VR
5
V
Operating temperature
Topr
−25~85
Storage temperature
Tstg
−40~100
Soldering temperature (5s)
Tsol
260 (Note 2)

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Pulse width 100s, repetitive frequency =100Hz
Note 2: Soldering must be performed 2mm from the bottom of the package body.




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