Features: • SMD LED with exceptional brightness• Multicolored• Luminous intensity categorized• Compatible with automatic placement equipment• EIA and ICE standard package• Compatible with infrared, vapor phase and wave solder processes according to CECC• A...
TLMEK3100: Features: • SMD LED with exceptional brightness• Multicolored• Luminous intensity categorized• Compatible with automatic placement equipment• EIA and ICE standard packa...
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• SMD LED with exceptional brightness
• Multicolored
• Luminous intensity categorized
• Compatible with automatic placement equipment
• EIA and ICE standard package
• Compatible with infrared, vapor phase and wave
solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
IVmax/IVmin 2.0
• Lead-free device
Parameter |
Test Conditions |
Symbol |
Value |
Unit |
Reverse voltage per diode |
IR = 10 A |
VR |
6 |
V |
DC Forward current per diode |
Tamb 85 °C |
IF |
30 |
mA |
Surge forward current per diode |
tp 10 s |
IFSM |
0.5 |
A |
Power dissipation per diode |
Tamb 85 °C |
PV |
100 |
mW |
Junction temperature |
Tj |
125 |
°C | |
Operating temperature range |
Tamb |
40 to +100 |
°C | |
Storage temperature range |
Tstg |
55 to +100 |
°C | |
Soldering temperature |
t 5 s |
Tsd |
260 |
°C |
Thermal resistance junction/ambient |
mounted on PC board (pad size > 16 mm2) |
RthJA |
400 |
K/W |
The TLMEK3100 has been designed to meet the increasing demand for surface mounting technology.
The package of the TLMEK3100 is the PLCC-3(equivalent to a size B tantalum capacitor).
TLMEK3100 consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy.
The TLMEK3100 consists of a red and yellow chip. So it is possible to choose the color in one device.