Features: SMD LED with exceptional brightness Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor phase and wave solder processes according to CECC Available in 8 mm tape Low profile package Non-diffused lens: e...
TLME3100: Features: SMD LED with exceptional brightness Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor phase and wav...
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Parameter |
Test Conditions |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
5 |
V | |
DC forward current |
Tamb 60 |
IF |
30 |
mA |
Surge forward current |
tp 10 s |
IFSM |
0.1 |
A |
Power dissipation |
Tamb 60 |
PV |
80 |
mW |
Junction temperature |
Tj |
100 |
||
Operating temperature range |
Tamb |
40 to +100 |
||
Storage temperature range |
Tstg |
55 to +100 |
||
Soldering temperature |
t 5 s |
Tsd |
260 |
|
Thermal resistance junction/ambient |
mounted on PC board (pad size > 16 mm2) |
RthJA |
400 |
K/W |
The TLME3100 has been designed to meet the increasing demand for AlInGaP technology.
The package of the TLME3100 is the PLCC2(equivalent to a size B tantalum capacitor).
TLME3100 consists of a lead frame which is surrounded with a white thermoplast. The reflector inside this package is filled up with clear epoxy.