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TLEGD1100B

Features: • Surface-mount devices• 3.2 (L) * 2.8 (W) * 1.9 (H) mm• Flat-top type• InGaN LEDs• High luminous intensity• Low drive current, high-intensity light emission• Colors: Blue d=470nm(typ) Green d=528nm(typ)• Pb free reflow soldering is possibl...

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SeekIC No. : 004521074 Detail

TLEGD1100B: Features: • Surface-mount devices• 3.2 (L) * 2.8 (W) * 1.9 (H) mm• Flat-top type• InGaN LEDs• High luminous intensity• Low drive current, high-intensity light emi...

TLEGD1100B Data Sheet

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Part Number:
TLEGD1100B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Surface-mount devices
• 3.2 (L) * 2.8 (W) * 1.9 (H) mm
• Flat-top type
• InGaN LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: Blue d=470nm(typ)
   Green d=528nm(typ)
• Pb free reflow soldering is possible


Application

•automotive use, message signboards, backlighting etc.
• Standard embossed tape packing: T11 (2000/reel)
                                                          8-mm tape reel


Specifications

Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR(V)
Power Dissipation
PD(mW)
Operating
Temperature
Topr()
Storage
Temperature
Tstg()
TLBD1100B
30
4
120
-40~100
-40~100
TLEGD1100B

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating


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