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TLEGC1002

Features: • Surface-mount devices• 2.0 (L) * 1.25 (W) * 1.1 (H) mm• InGaN LEDs• High luminous intensity• Low drive current, high-intensity light emission• Colors: Blue d=472nm (typ) Green d=535nm (typ)• Pb-free reflow soldering is possible...

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SeekIC No. : 004521070 Detail

TLEGC1002: Features: • Surface-mount devices• 2.0 (L) * 1.25 (W) * 1.1 (H) mm• InGaN LEDs• High luminous intensity• Low drive current, high-intensity light emission• Colors:...

TLEGC1002 Data Sheet

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Part Number:
TLEGC1002
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Surface-mount devices
• 2.0 (L) * 1.25 (W) * 1.1 (H) mm
• InGaN LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: Blue d=472nm (typ)
Green d=535nm (typ)
• Pb-free reflow soldering is possible
• ESD withstand voltage according to MIL STD 883D,Method 3015.7 : 800V
• Applications: message signboards, backlighting etc.
• Standard embossed tape packing: T02 (3000/reel)
8-mm tape reel


Specifications

Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation Temperature
Topr (°C)
Storage Temperature
Tstg (°C)
TLBC1002
15
4
63
−40~85
−40~100
TLEGC1002

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating


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