TGA8810-SCC

RF Amplifier 2.0-10GHz Gain Block Self Biased

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SeekIC No. : 00612508 Detail

TGA8810-SCC: RF Amplifier 2.0-10GHz Gain Block Self Biased

floor Price/Ceiling Price

US $ 39.53~49.91 / Piece | Get Latest Price
Part Number:
TGA8810-SCC
Mfg:
TriQuint Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 0~50
  • 50~100
  • Unit Price
  • $49.91
  • $39.53
  • Processing time
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2025/1/12

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Product Details

Quick Details

Type : Gain Block Amplifier Operating Frequency : 2 GHz to 10 GHz
Noise Figure : 6 dB Operating Supply Voltage : 5 V
Supply Current : 150 mA Package / Case : 1.88 mm x 1.65 mm    

Description

Bandwidth :
Output Intercept Point :
Maximum Operating Temperature :
Mounting Style :
Packaging :
Operating Supply Voltage : 5 V
Type : Gain Block Amplifier
Supply Current : 150 mA
Noise Figure : 6 dB
Operating Frequency : 2 GHz to 10 GHz
Package / Case : 1.88 mm x 1.65 mm


Specifications

Positive supply voltage, VD1, VD2 ...................................................................................8.5 V
Power dissipation at (or below) 25°C base -plate temperature, PD* ............................2.4W
Operating channel temperature, TCH ** ..................................................................... 150°C
Mounting temperature (30 sec), TM ..............................................................................320°C
Storage temperature range, TSTG ....................................................................- 65 to 150°C




Description

The TriQuint TGA8810 -SCC is a self-biased general purpose amplifier. Two gain stages employ shunt feedback to pr oduce flat gain to 10 -GHz. Output power at 1- dB gain compression is typically 17-dBm and noise figure is 6 -dB. The TGA8810-SCC uses on-chip DC blocks to allow dir ect cascading. Three different on-chip self-bias resistors provide the flexibility of selecting bias cur rent and RF per formance.

The TGA8810-SCC is available in chip for m and is readily assembled using automated equipment. Bond pad and backside metallization is gold plated for compatibil ity with eutectic alloy attachment methods as well as the ther mocompression and thermosonic wire-bonding processes.




Parameters:

Technical/Catalog InformationTGA8810-SCC
VendorTriquint Semiconductor Inc
CategoryRF and RFID
FunctionAmplifier
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names TGA8810 SCC
TGA8810SCC



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