TGA8061-SCC

RF Amplifier 0.1-3.5GHz LNA Self Biased

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SeekIC No. : 00613109 Detail

TGA8061-SCC: RF Amplifier 0.1-3.5GHz LNA Self Biased

floor Price/Ceiling Price

Part Number:
TGA8061-SCC
Mfg:
TriQuint Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/4

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Product Details

Description

Type :
Operating Frequency :
Noise Figure :
Bandwidth :
Output Intercept Point :
Operating Supply Voltage :
Supply Current :
Maximum Operating Temperature :
Mounting Style :
Package / Case :
Packaging :


Features:

• 100 MHz to 3.5 GHz Frequency Range
• 3 dB Bandwidth Exceeds 5 Octaves
• 2.4 dB Noise Figure with Low Input andOutput SWR
• 18 dB Gain
• 15 dBm Output Power at 1 dB GainCompression
• Operates from Single 12V Supply
• 1.524 x 1.524 x 0.102 mm (0.060 x 0.060x 0.004 in.)



Specifications

Positive supply voltage, V+............................16 V
Bias control voltage range, VADJ.....................0 V to 15 V
Positive supply current, I+........................200 mA
Pow er dissipation, PD, at (or below) 25oC base-plate temperature *..4.3 W
Operating Channel temperature, TCH **...................150oC
Mounting temperature (30 sec.), TM......................320oC
Storage temperature range, TSTG...................-65 to 150oC




Description

The TriQuint TGA8061-SCC is a GaAs monolithic low noise amplifier intended foruse as a universal gain block in applications requiring simultaneous flat gain, lownoise figure, and low SWR over a very wide bandwidth. Three FET stages withresistive feedback maintain highly repeatable linear phase and amplitudecharacteristics.

The high isolation, low SWR, and unconditional stability of the TGA8061-SCC makeit ideal for following or driving mixers and filters. Small size and low external partscount simplify system design and integration into higher-level assemblies.

Bond pad and backside metallization is gold plated for compatibility with eutecticalloy attachment methods as well as thermocompression and thermosonic wirebonding processes. Ground is provided to the circuit through vias to the backsidemetallization.




Parameters:

Technical/Catalog InformationTGA8061-SCC
VendorTriquint Semiconductor Inc
CategoryRF and RFID
FunctionAmplifier
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names TGA8061 SCC
TGA8061SCC



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