TFP201PZP

Display Interface IC PanelBus DVI Receiver 112MHz

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SeekIC No. : 00386894 Detail

TFP201PZP: Display Interface IC PanelBus DVI Receiver 112MHz

floor Price/Ceiling Price

US $ 4.09~5.8 / Piece | Get Latest Price
Part Number:
TFP201PZP
Mfg:
Texas Instruments
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~25
  • 25~100
  • 100~250
  • Unit Price
  • $5.8
  • $4.89
  • $4.49
  • $4.09
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/6/6

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Product Details

Quick Details

Package / Case : HTQFP-100 Packaging : Tray    

Description

Supply Current :
Operating Temperature Range :
Package / Case : HTQFP-100
Packaging : Tray


Features:

` Supports SXGA Resolution
  (Output Pixel Rates Up to 112 MHz)
` Digital Visual Interface (DVI) Specification Compliant1
` True-Color, 24 Bit/Pixel, 16.7M Colors at 1
  or 2-Pixels Per Clock
` Laser Trimmed Internal Termination
  Resistors for Optimum Fixed Impedance Matching
` Skew Tolerant Up to One Pixel Clock Cycle
` 4x Over-Sampling
` Reduced Power Consumption 1.8 V Core
  Operation With 3.3 V I/Os and Supplies2
` Reduced Ground Bounce Using Time
  Staggered Pixel Outputs
` Lowest Noise and Best Power Dissipation
  Using TI PowerPADE Packaging
` Advanced Technology Using TI 0.18-mm
  EPIC-5E CMOS Process
` TFP201A Incorporates HSYNC Jitter Immunity3



Pinout

  Connection Diagram


Specifications

Supply voltage range, DVDD, AVDD, OVDD, PVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . .-0.3 V to 4 V
Input voltage range, logic/analog signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V to 4 V
Operating ambient temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to 150°C
Case temperature for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .260°C
Package power dissipation/PowerPADE: Soldered (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 W
Not soldered (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7 W
ESD Protection, all pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2.5 KV Human Body Model
JEDEC latchup (EIA/JESD78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu plate PCB thermal plane. Specified at
maximum allowed operating temperature, 70°C.
2. PowerPADE bond pad on the backside of the package is not soldered to a thermal plane. Specified at maximum allowed operating
temperature, 70°C.



Description

The Texas Instruments TFP201 and TFP201A are TI PanelBusE flat panel display products, part of a comprehensive family of end-to-end DVI 1.0 compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP201/201A finds applications in any design requiring high-speed digital interface.

The TFP201/201A supports display resolutions up to SXGA in 24-bit true color pixel format. The TFP201/201A offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time staggered pixel outputs for reduced ground bounce.

PowerPADE advanced packaging technology results in best of class power dissipation, footprint, and ultra-low ground inductance.

The TFP201/201A combines PanelBusE circuit innovation with TI's advanced 0.18-mm EPIC-5E CMOS process technology, along with TI PowerPADE package technology to achieve a reliable, low-powered, low noise, high-speed digital interface solution.




Parameters:

Technical/Catalog InformationTFP201PZP
VendorTexas Instruments
CategoryIntegrated Circuits (ICs)
Number of Drivers/Receivers-
TypeReceiver
Voltage - Supply3 V ~ 3.6 V
Package / Case100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP
PackagingTray
Protocol-
Drawing Number296; 4146929; PZP; 100
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names TFP201PZP
TFP201PZP
296 9990 ND
2969990ND
296-9990



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