Transistor Output Optocouplers Phototransistor Out Single CTR 50-600%
TCET1100G: Transistor Output Optocouplers Phototransistor Out Single CTR 50-600%
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Input Type : | DC | Maximum Collector Emitter Voltage : | 70 V | ||
Maximum Collector Emitter Saturation Voltage : | 0.3 V | Isolation Voltage : | 5000 Vrms | ||
Current Transfer Ratio : | 600 % | Maximum Forward Diode Voltage : | 1.6 V | ||
Maximum Collector Current : | 50 mA | Maximum Power Dissipation : | 265 mW | ||
Maximum Operating Temperature : | + 100 C | Minimum Operating Temperature : | - 40 C | ||
Package / Case : | PDIP-4 | Packaging : | Tube |
• switch-mode power supplies
• line receiver
• computer peripheral interface
• microprocessor system interface
• Circuits for safe protective separation against electrical shock according to safety class II (reinforced isolation):
- for appl. class I - IV at mains voltage 300 V
- for appl. class I - III at mains voltage 600 V according to DIN EN 60747-5-5.
Coupler | ||||
Parameter | Test condition |
Symbol |
Value |
Unit |
Isolation test voltage (RMS) | t = 1 min |
VISO |
5000 |
VRMS |
Operating ambient temperature range |
Tamb |
- 40 to + 100 |
||
Storage temperature range |
Tstg |
- 55 to + 125 |
||
Soldering temperature | 2 mm from case, 10 s |
Tsld |
260 |
|
Input | ||||
Reverse voltage |
VR |
6 |
V | |
Forward current |
IF |
60 |
mA | |
Forward surge current | tp 10 s |
IFSM |
1.5 |
mA |
Output | ||||
Collector emitter voltage |
VCEO |
20 |
V | |
Emitter collector voltage |
VECO |
7 |
V | |
Collector current |
IC |
20 |
mA | |
Collector peak current | tP/T = 0.5, tP 10 ms |
ICM |
100 |
mW |
Notes
(1) Tamb = 25,unless otherwise specified. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability.
(2) Refer to wave profile for soldering conditions for through hole devices (DIP).