TCDT1MMW Selling Leads, Price trend, TCDT1MMW DataSheet download, circuit diagram from SeekIC.com

Features: • Leadless chip form, no lead damage• Lead-free solder joint, no wire bond & lead frame• Low profile package• For surface mounted applications• Built-in strain relief• Low power loss, High efficiency• High current capability• High surge...

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SeekIC No. : 004515504 Detail

TCDT1MMW: Features: • Leadless chip form, no lead damage• Lead-free solder joint, no wire bond & lead frame• Low profile package• For surface mounted applications• Built-in s...

TCDT1MMW Data Sheet

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Part Number:: TCDT1MMW
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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268 Transactions

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Upload time: 2025/1/12

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Product Details

Description

Features:

• Leadless chip form, no lead damage
• Lead-free solder joint, no wire bond & lead frame
• Low profile package
• For surface mounted applications
• Built-in strain relief
• Low power loss, High efficiency
• High current capability
• High surge capacity
• Plastic package has UL Flammability Classification 94V-0
• RoHS Compliance

Specifications

Symbol	Description	TCDT 1QW	TCDT 1VW	TCDT 1YW	TCDT 1ZW	TCDT 1MMW	Unit	Conditions
V_RRM	Max. Repetitive Peak Reverse Voltage	1200	1400	1600	1800	2000	V
V_RMS	Max. RMS Voltage	840	980	1120	1260	1400	V
V_DC	Max. DC Blocking Voltage	1200	1400	1600	1800	2000	V
I_F(AV)	Average Forward Rectified Current	1.0					A	See Fig.1
I_FSM	Peak Forward Surge Current	30					A	8.3ms single half sine-wave superimposed onrated load (JEDEC Method)
V_F	Max. Instantaneous Forward Voltage	1.25			2.0		V	I_F=1.0A
I_R	Max. DC Reverse Current at Rated DC Blocking Voltage	5					A	T_A=25
		30						T_A=125
		50						T_A=150
C_J	Typical Junction Capacitance	12					pF	V_R=4V, f=1MHz
R_thJA	Typical Thermal Resistance	80					/W	Note
R_thJL	Typical Thermal Resistance	40					/W	Note
T_J,T_STG	Operating Junction and Storage Temperature Range	-65 to +175

TCDT1MMW

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