PinoutSpecifications Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 Continuous Drain Current (TJ = 150)a TA = 25 ID ±3.9 ±2.9 A TA = 85 ±2.8 ±2.1 Pulsed Drain Current(10 s Pulse Width) IDM ±10 Continuou...
Si5902DC: PinoutSpecifications Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 Continuous Drain Current (TJ = 150)a TA = 25 ID ±...
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Parameter | Symbol | 5 secs | Steady State | Unit | |
Drain-Source Voltage | VDS | 30 | V | ||
Gate-Source Voltage | VGS | ±20 | |||
Continuous Drain Current (TJ = 150)a | TA = 25 | ID | ±3.9 | ±2.9 | A |
TA = 85 | ±2.8 | ±2.1 | |||
Pulsed Drain Current(10 s Pulse Width) | IDM | ±10 | |||
Continuous Source Current (Diode Conduction)a | IS | 1.8 | 0.9 | ||
Maximum Power Dissipationa | TA = 25 | PD | 2.1 | 1.1 | W |
TA = 85 | 1.1 | 0.6 | |||
Soldering Recommendations (Peak Temperature)b, c | 260 | ||||
Operating Junction and Storage Temperature Range | TJ, Tstg | -55 to 150 |
Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.