Features: • Low profile package• Ideal for automated placement• Glass passivated chip junction• Low Zener impedance• Low regulation factor• Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C• Solder dip 260 °C, 40 seconds• Component in accordan...
SMZG3809B: Features: • Low profile package• Ideal for automated placement• Glass passivated chip junction• Low Zener impedance• Low regulation factor• Meets MSL level 1, per...
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Features: Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surfac...