SMZG3788

Features: • Low profile package• Ideal for automated placement• Glass passivated chip junction• Low Zener impedance• Low regulation factor• Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C• Solder dip 260 °C, 40 seconds• Component in accordan...

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SeekIC No. : 004496024 Detail

SMZG3788: Features: • Low profile package• Ideal for automated placement• Glass passivated chip junction• Low Zener impedance• Low regulation factor• Meets MSL level 1, per...

floor Price/Ceiling Price

Part Number:
SMZG3788
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/11/23

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Product Details

Description



Features:

• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Low Zener impedance
• Low regulation factor
• Meets MSL level 1, per J-STD-020C, LF max peak of 260 °C
• Solder dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC



Application

For general purpose regulation and protection applications.


Specifications

Operating junction and storage temperature range TJ, TSTG......... - 55 °C to + 150 °C


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