Features: • Ultra Fast Recovery: 60 nsec Maximum• PIV to 3 500 Volts• Hermetically Sealed• Void-Free Construction• Metallurgically Bonded• 175oC Maximum Operating Temperature• Micro Miniature Package• TX, TXV, and Space Level Screening Available
SGB10UFSMS: Features: • Ultra Fast Recovery: 60 nsec Maximum• PIV to 3 500 Volts• Hermetically Sealed• Void-Free Construction• Metallurgically Bonded• 175oC Maximum Operating...
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