Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCESURGE OVERLOAD RATING TO 250 AMPS PEAKIDEAL FOR PRINTED CIRCUIT BOARD APP...
SBU6D: Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR ...
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PARAMETER (TEST CONDITIONS) |
SYMBOL |
RATINGS |
UNITS | |||||||
Series Number |
SBU6A |
SBU6B |
SBU6D |
SBU6G |
SBU6J |
SBU6K |
SBU6M |
|||
Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
100 |
VOLTS | |
Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
70 | ||
Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | ||
Average Forward Rectified Current |
TC = 100 (Notes 1, 3) |
IO |
6 6 |
AMPS | ||||||
TA = 40 (Note 2) | ||||||||||
Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). TA = 150 |
IFSM |
250 | ||||||||
Maximum Forward Voltage (Per Diode) at 6 Amps DC |
VFM |
0.95 (Typical < 0.90) |
VOLTS | |||||||
Maximum Average DC Reverse Current |
@ TA = 25 |
IRM |
1 50 |
A | ||||||
At Rated DC Blocking Voltage |
@ TA= 100 | |||||||||
Typical Thermal Resistance |
Junction to Ambient (Note 2 |
RJA RJC |
16.0 3.1 |
°C/W | ||||||
Junction to Case (Note 3) | ||||||||||
Minimum Insulation Breakdown Voltage (Circuit to Case) |
VISO |
2500 |
VOLTS | |||||||
Operating and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |
°C |