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SBU6B

Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCESURGE OVERLOAD RATING TO 250 AMPS PEAKIDEAL FOR PRINTED CIRCUIT BOARD APP...

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SBU6B: Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR ...

SBU6B Data Sheet

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Part Number:
SBU6B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 250 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING


Specifications

PARAMETER (TEST CONDITIONS)
SYMBOL
RATINGS
UNITS
Series Number
SBU6A
SBU6B
SBU6D
SBU6G
SBU6J
SBU6K
SBU6M
Maximum DC Blocking Voltage
VRM
50
100
200
400
600
800
100
VOLTS
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
70
Maximum Peak Recurrent Reverse Voltage
VRRM
50
100
200
400
600
800
1000
Average Forward Rectified Current
TC = 100 (Notes 1, 3)
IO
6
6
AMPS
TA = 40 (Note 2)
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). TA = 150
IFSM
250
Maximum Forward Voltage (Per Diode) at 6 Amps DC
VFM
0.95 (Typical < 0.90)
VOLTS
Maximum Average DC Reverse Current
@ TA = 25
IRM
1
50
A
At Rated DC Blocking Voltage
@ TA= 100
Typical Thermal Resistance
Junction to Ambient (Note 2
RJA
RJC
16.0
3.1
°C/W
Junction to Case (Note 3)
Minimum Insulation Breakdown Voltage (Circuit to Case)
VISO
2500
VOLTS
Operating and Storage Temperature Range
TJ,TSTG
-55 to +150
°C



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