S71PL064J

Features: Power supply voltage of 2.7 to 3.1 volt High performance-55 ns - 65 ns (65 ns Flash, 70ns pSRAM)Packages- 7 x 9 x 1.2mm 56 ball FBGA- 8 x 11.6 x 1.2mm 64 ball FBGA- 8 x 11.6 x 1.4mm 84 ball FBGA Operating Temperature- 25 to +85°C- 40 to +85°CSpecifications(Above which the useful life may...

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SeekIC No. : 004482927 Detail

S71PL064J: Features: Power supply voltage of 2.7 to 3.1 volt High performance-55 ns - 65 ns (65 ns Flash, 70ns pSRAM)Packages- 7 x 9 x 1.2mm 56 ball FBGA- 8 x 11.6 x 1.2mm 64 ball FBGA- 8 x 11.6 x 1.4mm 84 bal...

floor Price/Ceiling Price

Part Number:
S71PL064J
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/26

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Product Details

Description



Features:

Power supply voltage of 2.7 to 3.1 volt
High performance
-55 ns
- 65 ns (65 ns Flash, 70ns pSRAM)
Packages
- 7 x 9 x 1.2mm 56 ball FBGA
- 8 x 11.6 x 1.2mm 64 ball FBGA
- 8 x 11.6 x 1.4mm 84 ball FBGA
Operating Temperature
- 25 to +85°C
- 40 to +85°C



Specifications

(Above which the useful life may be impaired. For user guidelines, not tested)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150
Ambient Temperature with Power Applied . . . . . . . . . . . . . -40 to +85
Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . . . . . -0.4V to 4.6V
DC Voltage Applied to Outputs in High-Z
State (note 1, 2, 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 3.7V
DC Input Voltage (note 1, 2, 3) . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 3.7V
Output Current into Outputs (Low). . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Static Discharge Voltage. . . . . . . . . >2001V (per MIL-STD-883, Method 3015)
Latch-up Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >200 mA

Notes:
1. VIH(MAX) = VCC  + 0.5V for pulse durations less than 20 ns.
 2. VIL(MIN) = 0.5V for pulse durations less than 20 ns.
3. Overshoot and undershoot specifications are characterized and are not 100% tested.




Description

The S71PL064J series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:
  -One or more S29PL (Simultaneous Read/Write) Flash memory die p
  -SRAM or SRAM
The 256Mb Flash memory consists of two S29PL127J devices. In this case, CE#f2 is used to access the second Flash and no extra address lines are required.




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