S71PL032J

Features:

Power supply voltage of 2.7 to 3.1 volt
High performance
-55 ns
- 65 ns (65 ns Flash, 70ns pSRAM)
Packages
- 7 x 9 x 1.2mm 56 ball FBGA
- 8 x 11.6 x 1.2mm 64 ball FBGA
- 8 x 11.6 x 1.4mm 84 ball FBGA
Operating Temperature
- 25 to +85°C
- 40 to +85°C


Specifications

(Above which the useful life may be impaired. For user guidelines, not tested)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150
Ambient Temperature with Power Applied . . . . . . . . . . . . . -40 to +85
Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . . . . . -0.4V to 4.6V
DC Voltage Applied to Outputs in High-Z
State (note 1, 2, 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 3.7V
DC Input Voltage (note 1, 2, 3) . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 3.7V
Output Current into Outputs (Low). . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Static Discharge Voltage. . . . . . . . . >2001V (per MIL-STD-883, Method 3015)
Latch-up Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >200 mA

Notes:
1. V_IH(MAX) = V_CC  + 0.5V for pulse durations less than 20 ns.
 2. V_IL(MIN) = 0.5V for pulse durations less than 20 ns.
3. Overshoot and undershoot specifications are characterized and are not 100% tested.

Description

The S71PL032J series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:
  -One or more S29PL (Simultaneous Read/Write) Flash memory die p
  -SRAM or SRAM
The 256Mb Flash memory consists of two S29PL127J devices. In this case, CE#f2 is used to access the second Flash and no extra address lines are required.