Features: • 2A, 80V and 100V• rDS(ON) 1.05W• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• Majority Carrier Device• Related Literature- TB334 Guidelines for Soldering Surface Mo...
RFP2N10: Features: • 2A, 80V and 100V• rDS(ON) 1.05W• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance&...
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RFP2P08 | RFP2P10 | UNITS | |
Drain to Source Voltage (Note 1) VDSS | 80 | 100 | V |
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | 100 | V |
Continuous Drain Current ID | 2 | 2 | A |
Pulsed Drain Current (Note 3) IDM | 5 | 5 | A |
Gate to Source Voltage VGS | ±20 | ±20 | V |
Maximum Power Dissipation PD | 25 | 25 | W |
Linear Derating Factor | 0.2 | 0.2 | W/o Caaa |
Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | o C |
Maximum Temperature for Soldering | |||
Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | o C |
Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | o C |
These are N-channel enhancement mode silicon gate power field effect transistors RFP2N10 designed for applications such
switching regulators, switching converters. motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types RFP2N10 can be operated directly from integrate circuits.