Features: • -25A, -100V and -80V• rDS(ON) = 0.150W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFH25P08RFK25P08 RFH25P10RFK25P10 UNITS Drain to Source Voltage (Note 1) VDSS -80 -100 V Drain to Gate Vo...
RFH25P08: Features: • -25A, -100V and -80V• rDS(ON) = 0.150W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFH25P08RFK25P08...
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RFH25P08 RFK25P08 |
RFH25P10 RFK25P10 |
UNITS | |
Drain to Source Voltage (Note 1) VDSS | -80 | -100 | V |
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | -80 | -100 | V |
Continuous Drain Curren ID | -25 | -25 | A |
Pulsed Drain Current (Note 3) IDM | -60 | -60 | V |
Maximum Power Dissipation PD | ±20 | ±20 | V |
Maximum Power Dissipation | 150 | 150 | W |
Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | o C |
Linear Derating Factor | 0.0667 | 0.0667 | W/o C |
Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | o C |
Package Body for 10s, See Techbrief 334 (for TO-218AC) Tpkg | 260 | 260 | o C |