Features: • 1.8 V ± 0.1 V power supply for core (VDD)• 1.4 V to VDD power supply for I/O (VDDQ)• DLL circuitry for wide output data valid window and future frequency scaling• Separate independent read and write data ports with concurrent transactions• 100% bus...
R1Q3A3609: Features: • 1.8 V ± 0.1 V power supply for core (VDD)• 1.4 V to VDD power supply for I/O (VDDQ)• DLL circuitry for wide output data valid window and future frequency scalin...
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Parameter |
Symbol |
Rating |
Unit |
Notes |
Input voltage on any ball |
VIN |
−0.5 to VDD + 0.5 (2.5 V max.) |
V |
1,4 |
Input/output voltage |
VI/O |
−0.5 to VDDQ + 0.5 (2.5 V max.) |
V |
1,4 |
Core supply voltage |
VDD |
−0.5 to 2.5 |
V |
1,4 |
Output supply voltage |
VDDQ |
−0.5 to VDD |
V |
1,4 |
Junction temperature |
Tj |
+125 (max) |
°C |
|
Storage temperature |
TSTG |
−55 to +125 |
°C |
Notes: 1. All voltage is referenced to VSS.
2. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be restricted the Operation Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
3. These CMOS memory circuits have been designed to meet the DC and AC specifications shown in the tables
after thermal equilibrium has been established.
4. The following supply voltage application sequence is recommended: VSS, VDD, VDDQ, VREF then VIN. Remember, according to the Absolute Maximum Ratings table, VDDQ is not to exceed 2.5 V, whatever the instantaneous value of VDDQ.
The R1Q3A3636 is a 1,048,576-word by 36-bit, the R1Q3A3618 is a 2,097,152-word by 18-bit, and the R1Q3A3609 is a 4,194,304-word by 9-bit synchronous quad data rate static RAM fabricated with advanced CMOS technology using full CMOS six-transistor memory cell. R1Q3A3609 integrates unique synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (K and /K) and are latched on the positive edge of K and /K. The R1Q3A3609 is suitable for applications which require synchronous operation, high speed, low voltage, high density and
wide bit configuration. These products are packaged in 165-pin plastic FBGA package.