Features: • High current sink/source 25 mA/25 mA• Four external interrupt pins• Timer0 module: 8-bit/16-bit timer/counter• Timer1 module: 16-bit timer/counter• Timer2 module: 8-bit timer/counter• Timer3 module: 16-bit timer/counter• Timer4 module: 8-bit ti...
PIC18F6525: Features: • High current sink/source 25 mA/25 mA• Four external interrupt pins• Timer0 module: 8-bit/16-bit timer/counter• Timer1 module: 16-bit timer/counter• Timer2 m...
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SpecificationsDescriptionThe PIC1018SCL is one member of the PIC1018 family which is designed as o...
Parameter Name | Value |
Program Memory Type | Flash |
Program Memory (KB) | 48 |
CPU Speed (MIPS) | 10 |
RAM Bytes | 3,840 |
Data EEPROM (bytes) | 1024 |
Digital Communication Peripherals | 2-A/E/USART, 1-MSSP(SPI/I2C) |
Capture/Compare/PWM Peripherals | 2 CCP, 3 ECCP |
Timers | 2 x 8-bit, 3 x 16-bit |
ADC | 12 ch, 10-bit |
Comparators | 2 |
Temperature Range (C) | -40 to 125 |
Operating Voltage Range (V) | 2 to 5.5 |
Pin Count | 64 |
Ambient temperature under bias.....................................................................................................-40°C to +125°C
Storage temperature ..................................................................................................................... -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR and RA4) ......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ...................................................................................................... -0.3V to +5.5V
Voltage onMCLR with respect to VSS (Note 2) ...................................................................................... 0V to +13.25V
Voltage on RA4 with respect to VSS............................................................................................................ 0V to +8.5V
Total power dissipation (Note1) ............................................................................................................................1.0W
Maximum current out of VSS pin .........................................................................................................................300 mA
Maximum current into VDD pin ............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > vDD)..................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ............................................................................................... ±20 mA
Maximum output current sunk by any I/O pin.........................................................................................................25 mA
Maximum output current sourced by any I/O pin ...................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:Pdis = VDD x {IDD IOH} + {(VDD VOH) x IOH} + (VOL x IOL)
2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR/VPP pin, rather than pulling this pin directly to VSS.
This document contains device specific information for the following devices:
• PIC18F6525
• PIC18F6621
• PIC18F8525
• PIC18F8621
This family offers the advantages of all PIC18 microcontrollers namely, high computational performance at an economical price with the addition of high-endurance Enhanced Flash program memory. The PIC18F6525/6621/8525/8621 family also provides an enhanced range of program memory options and versatile analog features that make it ideal for complex, high performance applications .