PIC18F2450

Features:

• USB V2.0 Compliant
• Low speed (1.5 Mb/s) and full speed (12 Mb/s)
• Supports control, interrupt, isochronous and bulk transfers
• Supports up to 32 endpoints (16 bidirectional)
• 256-byte dual access RAM for USB
• On-chip USB transceiver with on-chip voltage regulator
• Interface for off-chip USB transceiver

Pinout






Specifications

Parameter Name	Value
Program Memory Type	Flash
Program Memory (KB)	16
CPU Speed (MIPS)	12
RAM Bytes	768
Digital Communication Peripherals	1-A/E/USART,
Capture/Compare/PWM Peripherals	1 CCP
Timers	1 x 8-bit, 2 x 16-bit
ADC	10 ch, 10-bit
USB (ch, speed, compliance)	1, Full Speed, USB 2.0
Temperature Range (C)	-40 to 85
Operating Voltage Range (V)	2 to 5.5
Pin Count	28

Absolute Maximum Ratings(†)
Ambient temperature under bias............................................................... .-40°C to +85°C
Storage temperature ............................................................................... -65°C to +150°C
Voltage on any pin with respect to V_SS (except V_DD,MCLR and RA4)..-0.3V to (V_DD + 0.3V)
Voltage on V_DD with respect to V_SS ............................................................... -0.3V to +7.5V
Voltage onMCLR with respect to V_SS (Note 2) ............................................... 0V to +13.25V
Total power dissipation (Note 1) .....................................................................................1.0W
Maximum current out of V_SS pin ..................................................................................300 mA
Maximum current into V_DD pin .....................................................................................250 mA
Input clamp current, I_IK (V_I < 0 or V_I > V_DD).............................................................. ±20 mA
Output clamp current, I_OK (V_O < 0 or V_O > V_DD) ....................................................... ±20 mA
Maximum output current sunk by any I/O pin.................................................................25 mA
Maximum output current sourced by any I/O pin .............................................................25 mA
Maximum current sunk by all ports ................................................................................200 mA
Maximum current sourced by all ports ............................................................................200 mA

Note 1: Power dissipation is calculated as follows:
Pdis = V_DD x {I_DD I_OH} + {(V_DD V_OH) x I_OH} + (V_OL x I_OL)
2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR/V_PP/ RE3 pin, rather than pulling this pin directly to V_SS.

† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

Description

Ideal for compact, single chip, Full Speed USB applications(12Mbit/s). The Enhanced Flash program memory PIC18F2450 allows operation when disconnected from the bus and easy field upgrades via the USB port.
USB Application Design Center