Features: Special Microcontroller Features:• Precision Internal Oscillator:- Factory calibrated to ±1%- Software selectable frequency range of 8 MHz to 32 kHz- Software tunable- Two-Speed Start-up mode- Crystal fail detect for critical applications- Clock mode switching during operation for ...
PIC16F785: Features: Special Microcontroller Features:• Precision Internal Oscillator:- Factory calibrated to ±1%- Software selectable frequency range of 8 MHz to 32 kHz- Software tunable- Two-Speed Star...
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SpecificationsDescriptionThe PIC1018SCL is one member of the PIC1018 family which is designed as o...
Special Microcontroller Features:
• Precision Internal Oscillator:
- Factory calibrated to ±1%
- Software selectable frequency range of 8 MHz to 32 kHz
- Software tunable
- Two-Speed Start-up mode
- Crystal fail detect for critical applications
- Clock mode switching during operation for power savings
• Power-Saving Sleep mode
• Wide operating voltage range (2.0V-5.5V)
• Industrial and extended temperature range
• Power-on Reset (POR)
• Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Brown-out Reset (BOR) with software control option
• Enhanced Low-Current Watchdog Timer (WDT) with on-chip oscillator (software selectable nominal 268 seconds with full prescaler) with software enable
• Multiplexed Master Clear with pull-up/input pin
• Programmable code protection
• High-Endurance Flash/EEPROM cell:
- 100,000 write Flash endurance
- 1,000,000 write EEPROM endurance
- Flash/Data EEPROM retention: > 40 years
Low-Power Features:
• Standby Current:
- 30 nA @ 2.0V, typical
• Operating Current:
- 8.5A @ 32 kHz, 2.0V, typical
- 100A @ 1 MHz, 2.0V, typical
• Watchdog Timer Current:
- 1A @ 2.0V, typical
• Timer1 Oscillator Current:
- 2A @ 32 kHz, 2.0V, typical
Peripheral Features:
• High-speed Comparator module with:
- Two independent analog comparators
- Programmable on-chip voltage reference (CVREF) module (% of VDD)
- 1.2V band gap voltage reference
- Comparator inputs and outputs externally accessible
- < 40 ns propagation delay
- 2 mv offset, typical
• Operational Amplifier module with 2 independent op amps:
- 3 MHz GBWP, typical
- All I/O pins externally accessible
• Two-Phase Asynchronous Feedback PWM module:
- Complementary output with programmable dead band delay
- Infinite resolution analog duty cycle
- Sync Output/Input for multi-phase PWM
- FOSC/2 maximum PWM frequency
• A/D Converter:
- 10-bit resolution and 14 channels (2 internal)
• 17 I/O pins and 1 input-only pin:
- High-current source/sink for direct LED drive
- Interrupt-on-pin change
- Individually programmable weak pull-ups
• Timer0: 8-bit timer/counter with 8-bit programmable prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator, if INTOSC mode selected
• Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
• Capture, Compare, PWM module:
- 16-bit Capture, max resolution 12.5 ns
- Compare, max resolution 200 ns
- 10-bit PWM with 1 output channel, max frequency 20 kHz
• In-Circuit Serial ProgrammingTM (ICSPTM) via two pins
• Shunt Voltage Regulator (PIC16HV785 only)
- 5 volt regulation
- 4 mA to 50 mA shunt range
Parameter Name | Value |
Program Memory Type | Flash |
Program Memory (KB) | 3.5 |
CPU Speed (MIPS) | 5 |
RAM Bytes | 128 |
Data EEPROM (bytes) | 256 |
Capture/Compare/PWM Peripherals | 1 CCP1 |
Timers | 2 x 8-bit, 1 x 16-bit |
ADC | 12 ch, 10-bit |
Comparators | 2 |
Temperature Range (C) | -40 to 125 |
Operating Voltage Range (V) | 2 to 15 |
Pin Count | 20 |
Absolute Maximum Ratings(†)
Ambient temperature under bias..............................-40 to +125°C
Storage temperature ......................................... -65°C to +150°C
Voltage on VDD with respect to VSS ........................... -0.3 to +6.5V
Voltage onMCLR with respect to Vss ........................-0.3 to +13.5V
Voltage on RB6 open-drain pin with respect to Vss.....-0.3 to +8.5V
Voltage on all other pins with respect to VSS..-0.3V to (VDD + 0.3V)
Total power dissipation(1) (PDIP and SOIC).........................800 mW
Total power dissipation(1) (SSOP).........................................600 mW
Maximum current out of VSS pin ............................................300 mA
Maximum current into VDD pin ...............................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)........................ ±20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD).................... ±20 mA
Maximum output current sunk by any I/O pin............................25 mA
Maximum output current sourced by any I/O pin .......................25 mA
Maximum current sunk by PORTA, PORTB, and PORTC (combined)..200 mA
Maximum current sourced PORTA, PORTB, and PORTC (combined)..200 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDDx {IDDIOH} + {(VDD VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to theMCLR pin, rather than pulling this pin directly to VSS.