Features: ·TrenchMOS™ technology·Low on-state resistance·Avalanche ruggedness rated·Logic level compatible·Surface mount package.Application·DC to DC converters·Synchronous rectification.PinoutSpecifications Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC)...
PHB100N03LT: Features: ·TrenchMOS™ technology·Low on-state resistance·Avalanche ruggedness rated·Logic level compatible·Surface mount package.Application·DC to DC converters·Synchronous rectification.Pinou...
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Features: ·Low gate charge·Low on-state resistance.Application·Optimized as a control FET in DC to...
Features: ·Standard level threshold·Very low on-state resistance.Application·Motors, lamps, soleno...
Symbol | Parameter | Conditions | Min | Max | Unit |
VDS | drain-source voltage (DC) | Tj =25 to 175 | - | 25 | V |
VDGR | drain-gate voltage (DC) | Tj =25 to 175 ; RGS = 20 k | - | 25 | V |
VGS | gate-source voltage | - | ±15 | V | |
VGSM | peak gate-source voltage | TP 50 s; pulsed; duty cycle = 25% | ±20 | ||
ID | drain current (DC) | Tmb = 25 ; VGS = 5 V; Figure 2 and 3 | - | 75 | A |
Tmb = 100 ; VGS = 5 V; Figure 2 | - | 67 | A | ||
IDM | peak drain current | Tmb = 100 ; pulsed; tp 10 s; Figure 3 | - | 240 | A |
Ptot | total power dissipation | Tmb = 25 ; Figure 1 | - | 125 | W |
Tstg | storage temperature | -55 | +175 | ||
Tj | junction temperature | -55 | +175 | ||
Source-drain diode | |||||
IS | source (diode forward) current (DC) | Tmb = 25 | - | 75 | A |
ISM | peak source (diode forward) current | Tmb = 25 ; pulsed; tp 10 s | - | 240 | A |
Avalanche ruggedness | |||||
EAS | non-repetitive avalanche energy | unclamped inductive load; ID =75 A; tp = 0.2 ms; VDD 55 V; RGS = 50 ; VGS = 5 V; starting at Tj = 25 ;Figure 4 |
- | 240 | mJ |
IAS | non-repetitive avalanche current | unclamped inductive load; VDD 15 V; RGS = 50 ;VGS = 5 V; Figure 4 | - | 75 | mJ |