Features: · Low collector-emitter saturation voltage VCEsat and corresponding low RCEsat· High collector current capability· High collector current gain· Improved efficiency due to reduced heat generation.Application· Power management applications· Low and medium power DC/DC convertors· Supply lin...
PBSS4320T: Features: · Low collector-emitter saturation voltage VCEsat and corresponding low RCEsat· High collector current capability· High collector current gain· Improved efficiency due to reduced heat gene...
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VCBO |
collector-base voltage | open emitter |
- |
20 |
V |
VCEO |
collector-emitter voltage | open base |
- |
20 |
V |
VEBO |
emitter-base voltage | open collector |
- |
5 |
V |
IC |
collector current (DC) |
- |
2 |
A | |
ICRP |
repetitive peak collector current | note 1 |
- |
3 |
A |
ICM |
peak collector current | single peak |
- |
5 |
A |
IB |
base current (DC) |
- |
0.5 |
A | |
Ptot |
total power dissipation | Tamb 25; note 2 |
- |
300 |
mW |
Tamb 25; note 3 |
- |
480 |
mW | ||
Tamb 25; note 4 |
- |
540 |
mW | ||
Tamb 25; notes 1 and 2 |
- |
1.2 |
W | ||
TSTG |
Storage temperature |
65 |
+150 |
||
Tj |
junction temperature |
- |
150 |
||
Tamb |
operating ambient temperature |
-65 |
+150 |
Notes
1. Operated under pulsed conditions: pulse width tp 100 ms; duty cycle d 0.25.
2. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
3. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
4. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 6 cm2.