PACDN2408C

·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 18kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) forma saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages

The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to- back zener connections provide ESD protection in cases where nodes with AC signals are present.

PACDN2408C are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge).  All I/Os PACDN2408C are rated at 18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV.

The Chip Scale Package format of PACDN2408C enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.