PACDN1408

• 4 or 8 transient voltage suppressors in a single package
• In-system Electrostatic Discharge (ESD) protection to ±25kV contact discharge per IEC 61000-4-2 international standard
• Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
• RoHS compliant (lead-free) finishing

The PACDN1404 and PACDN1408 are 4 and 8 channel transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.

PACDN1408 are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge). All I/Os are rated at ±25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins of PACDN1408 are protected for contact discharges to greater than ±30kV.

The Chip Scale Package format of PACDN1408 enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps of PACDN1408 allow for standard attachment to laminate boards without the use of underfill. The PACDN1404 and PACDN1408 are available with RoHS compliant lead-free finishing.