PACDN1404

·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 25kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages

The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.

PACDN1404 are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) PACDN1404 specification for Human Body Model (HBM) ESD, all pins are protected for contact discharg to greater than 30kV.

The Chip Scale Package format of thePACDN1404 enab extremely small footprints that are necessary in portab electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the us of underfill.