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NTHD4P02F

Features: • Leadless SMD Package Featuring a MOSFET and Schottky Diode• 40% Smaller than TSOP−6 Package with Similar ThermalCharacteristics• Independent Pinout to each Device to Ease Circuit Design• Ultra Low VF Schottky• Pb−Free Package is AvailableApplic...

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SeekIC No. : 004436668 Detail

NTHD4P02F: Features: • Leadless SMD Package Featuring a MOSFET and Schottky Diode• 40% Smaller than TSOP−6 Package with Similar ThermalCharacteristics• Independent Pinout to each Device...

NTHD4P02F Data Sheet

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Part Number:
NTHD4P02F
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Leadless SMD Package Featuring a MOSFET and Schottky Diode
• 40% Smaller than TSOP−6 Package with Similar ThermalCharacteristics
• Independent Pinout to each Device to Ease Circuit Design
• Ultra Low VF Schottky
• Pb−Free Package is Available


Application

• Li−Ion Battery Charging
• High Side DC−DC Conversion Circuits
• High Side Drive for Small Brushless DC Motors
• Power Management in Portable, Battery Powered Products


Pinout




Specifications

Parameter
Symbol
Value
Unit
Drain?to?Source Voltage
VDSS
20
V
Gate?to?Source Voltage
VGS
±12
V
Continuous Drain
Current		 SteadyState
TJ = 25°C
ID
−2.2
A
TJ = 85°C
−1.6
t 5 s
TJ = 25°C
−3.0
Pulsed DrainCurrent
tp=10 s
IDM
−9.0
A
PowerDissipation SteadyState
TJ = 25°C
PD
1.1
W
TJ = 85°C
0.6
t 5 s
TJ = 25°C
2.1
Continuous Source Current (Body Diode)
IS
−2.1
A
Operating Junction and StorageTemperature
TJ,TSTG
−55 to 150
°C
Lead Temperature for Soldering Purposes(1/8" from case for 10 s)
TL
260
°C



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